Hardcover bog   Paperback Bog
Vis udgåede udgivelser

Udgivelser med Xing-Chang Wei

25. maj 2017 – 30. juni 2020

Cover for Xing-Chang Wei · Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (Paperback Bog) (2020)
Paperback Bog
1. udgave
Modeling and Design of Electroma...
Xing-Chang Wei
Cover for Xing-Chang Wei · Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (Hardcover bog) (2017)
Hardcover bog
1. udgave
Modeling and Design of Electroma...
Xing-Chang Wei