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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging 2007 edition
Y C Lee
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging 2007 edition
Y C Lee
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials.
1460 pages, biography
| Medie | Bøger Hardcover bog (Bog med hård ryg og stift omslag) |
| Udgivet | 1. oktober 2006 |
| Oprindeligt udgivet | 2007 |
| ISBN13 | 9780387279749 |
| Forlag | Springer-Verlag New York Inc. |
| Antal sider | 1460 |
| Mål | 178 × 254 × 73 mm · 3,43 kg |
| Sprog | Engelsk |
| Klipper/redaktør | Lee, Y.C. |
| Klipper/redaktør | Suhir, Ephraim |
| Klipper/redaktør | Wong, C.P. |
![Cover for Y C Lee · Manufacturing Challenges in Electronic Packaging (Paperback Bog) [Softcover reprint of the original 1st ed. 1998 edition] (2012)](https://imusic.b-cdn.net/images/item/original/590/9781461376590.jpg?y-c-lee-2012-manufacturing-challenges-in-electronic-packaging-paperback-bog&class=scaled&v=1433537479)